Applied Materials

OEM : Semiconductor

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Santa Clara, California, United States


We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality.

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Pattern-Shaping System Speeds Up Chip Production

📅 Date:

✍️ Author: Anton Shilov

🔖 Topics: extreme ultraviolet lithography

🏭 Vertical: Semiconductor

🏢 Organizations: Applied Materials

Applied Materials has introduced its new Centura Sculpta pattern-shaping system that promises to provide a cost-effective alternative to extreme ultraviolet (EUV) lithography double patterning used to print dense interconnect lines and vias. As a result, the solution can reduce the number of EUV steps, production complexity and costs while potentially improving yields.

To keep advancing transistor performance, power consumption and density, chipmakers must adopt more sophisticated process technologies with tighter critical dimensions. Usage of dual EUV exposure is inevitable to print smaller features with 3-nm, 2-nm and thinner nodes. But double EUV patterning is expensive, lengthy and resource-consuming.

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