Celestial AI

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Celestial AI Closes $175 Million Series C Funding Round Led by U.S. Innovative Technology Fund

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: Celestial AI, US Innovative Technology Fund, AMD, Samsung, Porsche


Celestial AI™, creator of the Photonic Fabric™ optical interconnect technology platform, today announced it raised $175 million in its Series C funding round led by Thomas Tull’s U.S. Innovative Technology Fund (USIT). In addition to USIT, the round included participation from new and existing investors including AMD Ventures, Koch Disruptive Technologies (KDT), Temasek, Temasek’s wholly owned subsidiary Xora Innovation, IAG Capital Partners, Samsung Catalyst, Smart Global Holdings (SGH), Porsche Automobil Holding SE, Engine Ventures, M-Ventures and Tyche Partners.

Amid the explosive growth in demand for generative AI applications and next-generation data centers, hyperscalers are increasingly constrained by utility power availability, memory capacity and high cost of operation. Celestial AI’s Photonic Fabric optical interconnect technology addresses these critical challenges by revolutionizing memory and compute fabrics. This transformational solution provides the foundational technology for users to continue making advancements in AI while maintaining scalable, sustainable and profitable business models. This latest round of funding will enable Celestial AI to execute multiple large-scale customer collaborations focused on commercializing its breakthrough Photonic Fabric technology platform.

Read more at Business Wire

Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: Celestial AI, IAG Capital Partners, Koch, Temasek


Celestial AI, the Photonic Fabric™ company, today announced it has raised $100 million in Series B funding led by IAG Capital Partners, Koch Disruptive Technologies (KDT) and Temasek’s Xora Innovation fund. Other major investors in the round include Samsung Catalyst, Smart Global Holdings (SGH), Porsche Automobil Holding SE, The Engine Fund, imec.xpand, M Ventures and Tyche Partners. Celestial AI’s Photonic Fabric technology platform delivers optical connectivity performance levels that are ten years more advanced than existing technology offerings.

After close collaboration with hyperscalers, AI compute and memory providers, Celestial AI is introducing the Photonic Fabric™, the optical interconnect for disaggregated, exascale compute and memory clusters. Photonic Fabric is unconstrained by package beachfront limitations and can deliver data to any location on the compute die, directly to the point of consumption. The bandwidth delivered by the Photonic Fabric is 25x greater and delivers more than 10X lower latency and power consumption than any optical interconnect alternative, such as Co-Packaged Optics (CPO).

Read more at Business Wire

Celestial AI Raises $56 Million Series A to Disrupt the Artificial Intelligence Chipset Industry with Novel Photonic-Electronic Technology Platform

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: Celestial AI, Koch, Broadcom


Celestial AI, an AI-accelerator company with a proprietary hardware and software platform for machine learning chipsets, today announced a $56 million Series A investment led by Koch Disruptive Technologies (KDT) with participation from Temasek’s Xora Innovation fund, The Engine, the venture firm spun out of MIT, Tyche Partners, Merck’s corporate venture fund, M-Ventures, IMEC XPand, and venture capital investor in the Princeton University ecosystem, Fitz Gate. The new capital will be used for expanding the global engineering team, product development and strategic supplier engagements, including Broadcom, to build the company’s Orion AI accelerator products. Celestial AI’s mission is to fundamentally transform the way computing is done with a new processing system, based on their proprietary Photonic Fabric™ technology platform, that uses light for data movement both within chip and between chips.

Read more at Business Wire