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Understanding Thermal Challenges in EV Charging Applications

πŸ“… Date:

✍️ Author: Jeff Smoot

🏭 Vertical: Electrical Equipment

🏒 Organizations: CUI Devices, DigiKey Electronics

As EVs emerge as the dominant mode of transportation, factors such as battery range and even quicker charging rates will play pivotal roles in sustaining the global economy. Enhancements in EV charging infrastructure will necessitate advancements across various domains, with thermal management standing out as a key area requiring technological evolution.

By shedding weight and size constraints, DC chargers can seamlessly incorporate additional components to enhance both their current throughput and operating voltage. These chargers leverage state-of-the-art semiconductor devices for rectifying power, alongside filters and power resistors, all of which generate substantial heat during operation. While the contributions of filters and resistors to heat dissipation are noteworthy, the predominant heat emitter in an EV charging system is the Insulated Gate Bipolar Transistor (IGBT), a semiconductor device that has witnessed increased adoption in recent decades. This robust component has unlocked numerous possibilities in the charging domain, yet ensuring its adequate cooling remains a significant concern.

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How SCARA, Six-Axis, and Cartesian Pick-And-Place Robotics Optimize and Streamline Electronics Manufacturing Processes

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✍️ Author: Lisa Eitel

πŸ”– Topics: Industrial Robot

🏭 Vertical: Computer and Electronic, Semiconductor

🏒 Organizations: DigiKey Electronics

Hastening the adoption of robotics in semiconductor manufacture are burgeoning classes of six-axis robots, selective compliance assembly robot arms (SCARAs), cartesian machinery, and collaborative robots featuring reconfigurable or modular hardware as well as unifying software to greatly simplify implementation. These robots and their supplemental equipment must be designed, rated, and installed for cleanroom settings or else risk contaminating delicate wafers with impurities. Requirements are defined by ISO 14644-1:2015, which classifies cleanroom air cleanliness by particle concentration.

Advanced cleanroom-rated robotic end-of-arm tooling (EoAT or end effectors) such as grippers are core to semiconductor production. Here, EOATs must have high dynamics and the ability to execute tracing, placing, and assembling with exacting precision. In some cases, EoAT force feedback or machine vision boosts parts-handling accuracy by imparting adaptive capabilities β€” so pick-and-place routines are quickly executed even if there’s some variability in workpiece positions, for example. Such sensor and feedback advancements can sometimes render the complicated electronics-handling fixtures of legacy solutions unnecessary.

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