IAG Capital Partners

Assembly Line

RIOS Intelligent Machines Announces Successful Completion of $13 Million Series B Funding Round

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: RIOS, Yamaha, IAG Capital Partners


RIOS Intelligent Machines, a leader in AI-powered robotics for the manufacturing industry, is excited to announce the successful completion of a $13 million Series B funding round. This significant milestone was co-led by Yamaha Motor Corporation and IAG Capital Partners, marking a continued and strengthened partnership in advancing manufacturing and automation technologies.

This new round of funding will fuel RIOS’s growth in three key industry segments: wood products, beverage distribution, and packaged food products. The company will continue to roll out highly differentiated AI and vision-driven robotics solutions, starting with a groundbreaking product in the lumber and plywood handling sector.

Read more at Business Wire

Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: Celestial AI, IAG Capital Partners, Koch, Temasek


Celestial AI, the Photonic Fabric™ company, today announced it has raised $100 million in Series B funding led by IAG Capital Partners, Koch Disruptive Technologies (KDT) and Temasek’s Xora Innovation fund. Other major investors in the round include Samsung Catalyst, Smart Global Holdings (SGH), Porsche Automobil Holding SE, The Engine Fund, imec.xpand, M Ventures and Tyche Partners. Celestial AI’s Photonic Fabric technology platform delivers optical connectivity performance levels that are ten years more advanced than existing technology offerings.

After close collaboration with hyperscalers, AI compute and memory providers, Celestial AI is introducing the Photonic Fabric™, the optical interconnect for disaggregated, exascale compute and memory clusters. Photonic Fabric is unconstrained by package beachfront limitations and can deliver data to any location on the compute die, directly to the point of consumption. The bandwidth delivered by the Photonic Fabric is 25x greater and delivers more than 10X lower latency and power consumption than any optical interconnect alternative, such as Co-Packaged Optics (CPO).

Read more at Business Wire