Join Capital

Assembly Line

SEMRON secures €7.3M Seed funding for industry-first 3D AI semiconductor chips

📅 Date:

🔖 Topics: Funding Event

🏢 Organizations: SEMRON, Join Capital

German semiconductor tech company SEMRON announced it has secured €7.3 million in seed funding. Join Capital, led the current funding round, which saw participation from new investors SquareOne, OTB Ventures, and Hermann Hauser (Onsight Ventures).

SEMRON crafts powerful energy-efficient computer chips designed to enhance AI performance in compact smart devices. The company’s innovative approach utilises a three-dimensional space in chip design, allowing for unprecedented improvements in efficiency.

SEMRON has achieved a significant breakthrough in developing the world’s most energy-efficient semiconductor technology for AI inference. This proprietary technology, named CapRAM™, employs a novel semiconductor device architecture that calculates using a variable capacitor (‘memcapacitor’) instead of relying on currents like resistive approaches and transistors.

Read more at Tech EU