Maverick Capital
Assembly Line
Thintronics Inc. Closes $23M Series A Financing Round Led by Maverick Capital and Translink Capital
Thintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. Thintronics Inc. has raised a Series A funding round for $23M, led by Maverick Capital and Translink Capital. Series A funding will support commercialization of a novel insulator platform.
The company was founded on the idea that conventional assumptions guiding insulator material development limited the capacity of the industry to innovate. They have since developed a suite of high-performance materials that display electrical and mechanical characteristics that far outpace the state of the art. Thintronics’ CEO Stefan Pastine emphasizes that “the interconnect insulator is foundational to modern electronics; however, it has yet to be optimized to operate near the theoretical limit of insulation. Additionally, the supply chain is fragmented across multiple electronic architectures. It is our vision to optimize the insulator and unify it across the fabric.”
SiMa.ai Secures Funds and Readies New Generative Edge AI Platform
SiMa.ai, the software-centric, embedded edge machine learning system-on-chip company, announced it has raised an additional $70M of funding led by Maverick Capital, with participation from Point72 and Jericho, as well as existing investors Amplify Partners, Dell Technologies Capital, Lip-Bu Tan and others. SiMa.ai will utilize the $270M raised to date to continue meeting customer demand for edge AI/ML with its first-generation Machine Learning System-on-Chip (MLSoC) while accelerating the delivery of its second-generation MLSoC for release in Q1 of 2025.