Canvas Category OEM : Computer and Electronic

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Primary Location Geneva, Geneva, Switzerland

Financial Status NYSE: STM

Electronic circuits form a mostly invisible part of the world we live in today. These circuits are present in microchips or just “chips”, which combine the latest advances in performance, intelligence and, efficiency. Hundreds or thousands of these chips are integrated into each of the millions and billions of electronic devices people across the globe interact with every day. It is in this unseen realm that STMicroelectronics creates the sparks that animate the products we use at any given moment. Our technology is found everywhere microelectronics makes a positive contribution to people’s lives. Chips from ST embedding the most advanced innovations are an essential part of products as diverse as cars and key fobs, giant factory machines and data center power supplies, washing machines and hard disks, and smartphones and toothbrushes. We help our customers make these devices more intelligent, more energy efficient, more connected, safer and more secure.

Assembly Line

eDSim, a simulator 50x faster than PSpice with an unlimited license to the ST community

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🔖 Topics: Open Source

🏢 Organizations: STMicroelectronics, SIMPLIS Technologies

eDSim uses the SIMetrix/SIMPLIS simulation engine and piecewise linear models of ST components to enable much faster convergence than alternative approaches involving nonlinearities. Internal testing with the L6983 synchronous step-down converter revealed that certain simulations requiring between 15 and 30 minutes on Pspice only required around 1 minute with eDSim. Considering that designers perform multiple simulation runs to tune their designs, eDSim can reduce simulation cycles for design projects by hours, if not days.

ST worked with SIMPLIS Technologies to ensure we could provide professional engineers with one of the most flexible licenses. For instance, working with one of our models doesn’t contribute to the eDSim node count or circuit size limit, regardless of its complexity.

Read more at The ST Blog

Sensor Fusion with AI Transforms the Smart Manufacturing Era

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✍️ Author: Majeed Ahmad

🔖 Topics: Sensor Fusion

🏢 Organizations: Bosch, STMicroelectronics

Bosch calls its new semiconductor fab in Dresden a smart factory with highly automated, fully connected machines and integrated processes combined with AI and internet of things (IoT) technologies for facilitating data-driven manufacturing. With machines that think for themselves and glasses with built-in cameras, maintenance work in this fab can be performed from 9,000 kilometers (about 5,592 miles) away.

STMicroelectronics (STMicro) has added compute power to sensing in what it calls an intelligent sensor processing unit (ISPU). It combines a DSP suited to run AI algorithms and MEMS sensor on the same chip. The merger of sensors and AI puts electronic decision-making on the edge, while enabling smart sensors to sense, process and take actions, bridging the fusion of technology and the physical world.

Read more at EE Times

Airbus and STMicroelectronics collaborate on power electronics for aircraft electrification

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🔖 Topics: Partnership

🏢 Organizations: Airbus, STMicroelectronics

Airbus, a global pioneer in the aerospace industry, and STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles.

The collaboration builds on evaluations already conducted by both companies to explore the benefits of wide bandgap semiconductor materials for aircraft electrification. Wide bandgap semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN) have superior electrical properties compared with traditional semiconductors like silicon. They enable the development of smaller, lighter and more efficient high-performance electronic devices and systems, particularly in applications requiring high power, high frequency, or high-temperature operations.

Read more at Airbus Newsroom